Kjøpe 11330-80RA med BYCHPS
Kjøp med garanti
11330-80RA
- Delenummer:
- 11330-80RA
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- DISCONNECT BLOCK ASSY
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12606 Pieces
- Dataark:
- 11330-80RA.pdf
Introduksjon
BYCHIPS er strømprodusenten for 11330-80RA, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 11330-80RA via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | 11330-80RA |
| Beskrivelse: | DISCONNECT BLOCK ASSY |
| Email: | [email protected] |
Beslektede deler til 11330-80RA
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
11330-80A | Eaton | DISC. BLOCK ASSY | Forespørsel |
 |
0032.1148 | Schurter Inc. | FEL/SIL CARRIER 5X20 IP 40 | Forespørsel |
|
LPF1-24 | Eaton | FUSE PULLER LIGHTED 24V | Forespørsel |
|
11330-83 | Eaton | DISC. BLOCK ASSY. | Forespørsel |
 |
01520900U | Littelfuse Inc. | DUST COVER FOR MAXIHOLDER 152001 | Forespørsel |
 |
912-200 | Littelfuse Inc. | FUSE SPRING 0.026 GALV WIRE | Forespørsel |
|
BO3-02BF | Eaton | FUSEHOLDER CAP | Forespørsel |
|
11330-82 | Eaton | DISC BLOCK ASSY | Forespørsel |
|
2A1630-6 | Eaton | MAIN DEVICE SUB ASSY 200A | Forespørsel |
|
CTPT5 | Littelfuse Inc. | HARDWARE ACC POLE INSULATION CAP | Forespørsel |
|
11330-80 | Eaton | DISC. BLOCK ASS'Y | Forespørsel |
|
11330-81 | Eaton | DISC. BLOCK ASS'Y | Forespørsel |
|
11330-84 | Eaton | SHIELD SUB ASSEMBLY | Forespørsel |
|
0D0Z18RDZ | Littelfuse Inc. | GAUGE RING FOR 10A D02 FUSE RED | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers