Kjøpe 1461791011 med BYCHPS
Kjøp med garanti
1461791011
- Delenummer:
- 1461791011
- Beskrivelse:
- RX 2 COIL 1 LAYER 9.9UH
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13075 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 1461791011, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1461791011 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | 2 Coil, 1 Layer |
|---|---|
| Toleranse: | ±2% |
| Størrelse / Dimensjon: | 1.575" L x 1.850" W x 0.020" H (40.00mm x 47.00mm x 0.52mm) |
| Serie: | NuCurrent®, PowerLife™, 146179 |
| Q @ Freq: | 23 @ 200kHz |
| Andre navn: | 146179-1011 WM15001 |
| Driftstemperatur: | - |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 1461791011 |
| induktans: | 9.9µH |
| Funksjon: | Receiver |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 2 Coil, 1 Layer 9.9µH Wireless Charging Coil Receiver 390 mOhm |
| Beskrivelse: | RX 2 COIL 1 LAYER 9.9UH |
| DC-motstand (DCR): | 390 mOhm |
| Nåværende vurdering: | - |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til 1461791011
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1461792001 | Molex, LLC | RX 2 COIL 1 LAYER 10.6UH | Forespørsel |
 |
1461791001 | Molex, LLC | RX 1 COIL 1 LAYER 11.6UH | Forespørsel |
 |
1461798011 | Molex, LLC | RX 1 COIL 1 LAYER 2.6UH | Forespørsel |
 |
1461794001 | Molex, LLC | RX 2 COIL 1 LAYER 8.9UH | Forespørsel |
 |
1461794011 | Molex, LLC | RX TX 2 COIL 1 LAYER 9.6UH 5.6UH | Forespørsel |
 |
1461798001 | Molex, LLC | RX 1 COIL 1 LAYER 2.9UH | Forespørsel |
 |
WR-483250-15M2-G | TDK Corporation | RX 1 COIL 1 LAYER BIFILAR 10.5UH | Forespørsel |
 |
1461798021 | Molex, LLC | RX 1 COIL 1 LAYER 4UH | Forespørsel |
 |
1461790001 | Molex, LLC | RX 1 COIL 1 LAYER 17.3UH | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers