Kjøpe 170E3956 med BYCHPS
Kjøp med garanti
170E3956
- Delenummer:
- 170E3956
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- FUSE 80A 2000V 1*SK/246 GDC DC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18705 Pieces
- Dataark:
- 1.170E3956.pdf2.170E3956.pdf
Introduksjon
BYCHIPS er strømprodusenten for 170E3956, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 170E3956 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Størrelse / Dimensjon: | 8.543" L x 2.244" W x 2.756" H (217.00mm x 57.00mm x 70.00mm) |
|---|---|
| Serie: | * |
| emballasje: | Bulk |
| Pakke / tilfelle: | Rectangular, Blade |
| Monteringstype: | Bolt Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | 170E3956 |
| Beskrivelse: | FUSE 80A 2000V 1*SK/246 GDC DC |
| Email: | [email protected] |
Beslektede deler til 170E3956
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
170E3933 | Eaton | FUSE 100A 4000V 1SKN/394ADC DC | Forespørsel |
|
170E3945 | Eaton | FUSE 125A 2000V 1*SKN/246ADC DC | Forespørsel |
|
170E3579 | Eaton | FUSE 100A 750V DC GR 1 BKN/130 | Forespørsel |
|
170E3844 | Eaton | FUSE 63A 900V 00/80 AR | Forespørsel |
|
170E3586 | Eaton | FUSE 125A 750V 1 EK/155 GDC DC | Forespørsel |
|
170E3942 | Eaton | FUSE 63A 2000V 1 SKN/246 AR DC | Forespørsel |
|
170E3950 | Eaton | FUSE 20A 2000V 1 SKN/246 GDC DC | Forespørsel |
|
170E3582 | Eaton | FUSE 160A 750V 1 SFKN/160 GR DC | Forespørsel |
|
170E3845 | Eaton | FUSE 80A 900V 00/80 AR | Forespørsel |
|
170E3917 | Eaton | FUSE 40A 4000V DC 1*SKN/394 | Forespørsel |
|
170E3976 | Eaton | FUSE 10A 2000V 1SKN/246 GDC DC | Forespørsel |
|
170E3846 | Eaton | FUSE 100A 900V 00/80 AR | Forespørsel |
|
170E3587 | Eaton | FUSE 160A 750V 1 EK/155 GDC DC | Forespørsel |
|
170E3584 | Eaton | FUSE 80A 750V 1 EK/155 GDC DC GR | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers