Kjøpe 170M1755 med BYCHPS
Kjøp med garanti
170M1755
- Delenummer:
- 170M1755
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- FUSE 80A 690V IEC AR 000FU/70
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17560 Pieces
- Dataark:
- 170M1755.pdf
Introduksjon
BYCHIPS er strømprodusenten for 170M1755, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 170M1755 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Størrelse / Dimensjon: | 2.126" L x 1.429" W x 0.945" H (54.00mm x 36.30mm x 24.00mm) |
|---|---|
| Serie: | * |
| emballasje: | Bulk |
| Pakke / tilfelle: | Rectangular, Blade |
| Monteringstype: | Bolt Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 170M1755 |
| Sikringstype: | Square |
| Beskrivelse: | FUSE 80A 690V IEC AR 000FU/70 |
| Email: | [email protected] |
Beslektede deler til 170M1755
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
170M1757 | Eaton | FUSE 125A 690V 000FU/70 AR CU | Forespørsel |
|
170M1750 | Eaton | FUSE 25A 690V 000FU/70 AR CU | Forespørsel |
|
170M1753 | Eaton | FUSE 50A 690V 000FU/70 AR CU | Forespørsel |
|
170M1754 | Eaton | FUSE 63A 690V 000FU/70 AR CU | Forespørsel |
|
170M1752 | Eaton | FUSE 40A 690V 000FU/70 AR CU | Forespørsel |
|
170M1751 | Eaton | FUSE 32A 690V 000FU/70 AR CU | Forespørsel |
|
170M1758 | Eaton | FUSE 160A 690V 000FU/70 AR CU | Forespørsel |
|
170M1756 | Eaton | FUSE 100A 690V 000FU/70 AR CU | Forespørsel |
|
170M1760 | Eaton | FUSE 250A 690V 000FU/70 AR CU | Forespørsel |
|
170M1761 | Eaton | FUSE 315A 690V IEC AR 000FU/70 | Forespørsel |
|
170M1759 | Eaton | FUSE 200A 690V 000FU/70 AR CU | Forespørsel |
|
170M1762 | Eaton | FUSE 350A 690V 000FU/70 AR CU | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog