Kjøpe 1812J1K50680GCT med BYCHPS
Kjøp med garanti
1812J1K50680GCT
- Delenummer:
- 1812J1K50680GCT
- Produsent:
- Knowles / Syfer
- Beskrivelse:
- CAP CER 1812
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17163 Pieces
- Dataark:
- 1812J1K50680GCT.pdf
Introduksjon
BYCHIPS er strømprodusenten for 1812J1K50680GCT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1812J1K50680GCT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | 1812J1K50680GCT |
| Utvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP CER 1812 |
| Email: | [email protected] |
Beslektede deler til 1812J1K50680GCT
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1812J1K50681FCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680JCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680GCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680FCT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680KCT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50681GCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680KCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50681GCT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50682JXR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50682MXR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50682JXT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680JCT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50680FCR | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50682MXT | Knowles Syfer | CAP CER 1812 | Forespørsel |
|
1812J1K50681JXT | Knowles Syfer | CAP CER 1812 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers