Kjøpe 1887103-4 med BYCHPS
Kjøp med garanti
1887103-4
- Delenummer:
- 1887103-4
- Beskrivelse:
- XT314S15
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12423 Pieces
- Dataark:
- 1887103-4.pdf
Introduksjon
BYCHIPS er strømprodusenten for 1887103-4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1887103-4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Andre navn: | XT314S15 |
| Produsentens varenummer: | 1887103-4 |
| Utvidet beskrivelse: | Relay Coil |
| Beskrivelse: | XT314S15 |
| Email: | [email protected] |
Beslektede deler til 1887103-4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1887102-3 | TE Connectivity Potter & Brumfield Relays | XT314LB2 | Forespørsel |
|
1887103-1 | TE Connectivity Potter & Brumfield Relays | XT314T30 | Forespørsel |
|
1887112-2 | TE Connectivity Potter & Brumfield Relays | XT374L24 | Forespørsel |
|
1887102-2 | TE Connectivity Potter & Brumfield Relays | XT314L24 | Forespørsel |
 |
1887101-7 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 16A 115V | Forespørsel |
|
1887103-3 | TE Connectivity Potter & Brumfield Relays | XT314R24 | Forespørsel |
|
1887112-6 | TE Connectivity Potter & Brumfield Relays | XT374L12 | Forespørsel |
 |
1887100-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 16A 24V | Forespørsel |
|
1887102-6 | TE Connectivity Potter & Brumfield Relays | XT314L12 | Forespørsel |
|
1887112-4 | TE Connectivity Potter & Brumfield Relays | XT374LE8 | Forespørsel |
|
1887102-1 | TE Connectivity Potter & Brumfield Relays | XT314LC4 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers