Kjøpe 1SV282TPH3F med BYCHPS
Kjøp med garanti
1SV282TPH3F
- Delenummer:
- 1SV282TPH3F
- Produsent:
- Toshiba Semiconductor
- Beskrivelse:
- DIODE VARACTOR 34V SINGLE ESC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12531 Pieces
- Dataark:
- 1SV282TPH3F.pdf
Introduksjon
BYCHIPS er strømprodusenten for 1SV282TPH3F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1SV282TPH3F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 34V |
|---|---|
| Leverandør Enhetspakke: | ESC |
| Serie: | - |
| Q @ Vr, F: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SC-79, SOD-523 |
| Andre navn: | 1SV282(TPH3,F) 1SV282TPH3FTR |
| Driftstemperatur: | 125°C (TJ) |
| Monteringstype: | Surface Mount |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 1SV282TPH3F |
| Utvidet beskrivelse: | Varactor Single 34V Surface Mount ESC |
| Diodetype: | Single |
| Beskrivelse: | DIODE VARACTOR 34V SINGLE ESC |
| Kapasitansforhold: | C2/C25 |
| Kapasitansforhold: | 12.5 |
| Kapasitans @ Vr, F: | 3pF @ 25V, 1MHz |
| Email: | [email protected] |
Beslektede deler til 1SV282TPH3F
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
1SV285TPH3F | Toshiba Semiconductor and Storage | DIODE VARACTOR 10V ESC | Forespørsel |
|
1SV280,H3F | Toshiba Semiconductor and Storage | DIODE VARACTOR 15V ESC | Forespørsel |
 |
BB149,115 | NXP USA Inc. | DIODE UHF VAR CAP 30V SOD323 | Forespørsel |
|
1SV281(TPH3,F) | Toshiba Semiconductor and Storage | DIODE VCO V/UHF 10V ESC | Forespørsel |
|
ZMV933TA | Diodes Incorporated | DIODE VAR CAP 42PF 12V SOD-323 | Forespørsel |
 |
FMMV2103TA | Diodes Incorporated | DIODE VAR CAPAC 30V 10PF SOT23-3 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers