Kjøpe 1SV308(TH3,F) med BYCHPS
Kjøp med garanti
1SV308(TH3,F)
- Delenummer:
- 1SV308(TH3,F)
- Produsent:
- Toshiba Semiconductor
- Beskrivelse:
- DIODE PIN 30V ESC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16224 Pieces
- Dataark:
- 1SV308(TH3,F).pdf
Introduksjon
BYCHIPS er strømprodusenten for 1SV308(TH3,F), vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1SV308(TH3,F) via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 30V |
|---|---|
| Leverandør Enhetspakke: | ESC |
| Serie: | - |
| Motstand @ Hvis, F: | 1.5 Ohm @ 10mA, 100MHz |
| Strømdissipasjon (maks): | - |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | SC-79, SOD-523 |
| Andre navn: | 1SV308(TH3F)DKR 1SV308FDKR 1SV308FDKR-ND |
| Driftstemperatur: | 125°C (TJ) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | 1SV308(TH3,F) |
| Utvidet beskrivelse: | RF Diode PIN - Single 30V 50mA ESC |
| Diodetype: | PIN - Single |
| Beskrivelse: | DIODE PIN 30V ESC |
| Nåværende - Maks: | 50mA |
| Kapasitans @ Vr, F: | 0.5pF @ 1V, 1MHz |
| Email: | [email protected] |
Beslektede deler til 1SV308(TH3,F)
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
QSMP-481B-TR1G | Broadcom Limited | DIODE PIN ATTENUATOR | Forespørsel |
 |
1SV307(TPH3,F) | Toshiba Semiconductor and Storage | SWITCHING DIODE 30V 2 USC | Forespørsel |
 |
1SV305,H3F | Toshiba Semiconductor and Storage | DIODE VARACTOR 10V ESC | Forespørsel |
 |
UM7306SM | Microsemi Corporation | DIODE PIN 600V SM | Forespørsel |
|
HSMS-285L-TR1G | Broadcom Limited | DIODE SCHOTTKY DETECT SS SOT-363 | Forespørsel |
|
HSMP-3880-TR2G | Broadcom Limited | DIODE PIN SWITCH 100V SOT-23 | Forespørsel |
|
1SV304TPH3F | Toshiba Semiconductor and Storage | DIODE VARACTOR 10V USC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers