Kjøpe 207DCN2R7M med BYCHPS
Kjøp med garanti
207DCN2R7M
- Delenummer:
- 207DCN2R7M
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP 200F 20% 2.7V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15329 Pieces
- Dataark:
- 207DCN2R7M.pdf
Introduksjon
BYCHIPS er strømprodusenten for 207DCN2R7M, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 207DCN2R7M via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.181" Dia (30.00mm) |
| Serie: | DCN |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Snap-In |
| Andre navn: | 1572-1356 207DCN2R7M-ND |
| Driftstemperatur: | -40°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | 207DCN2R7M |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Høyde - sittende (maks): | 2.047" (52.00mm) |
| Utvidet beskrivelse: | 200F ±20%(EDLC) Supercapacitor 2.7V Radial, Can - Snap-In 15 mOhm 1000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 15 mOhm |
| Beskrivelse: | CAP 200F 20% 2.7V T/H |
| kapasitans: | 200F |
| Email: | [email protected] |
Beslektede deler til 207DCN2R7M
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DVS-3R6D473T-R5 | Elna America | CAP 47MF 3.6V SURFACE MOUNT | Forespørsel |
 |
B49410B2126Q000 | EPCOS (TDK) | CAP 1200F -10% +30% 2.5V CHAS MT | Forespørsel |
 |
MAL219691204E3 | Vishay BC Components | CAP 15F -20% +80% 5.6V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog