Kjøpe 225MKP275KGE med BYCHPS
Kjøp med garanti
225MKP275KGE
- Delenummer:
- 225MKP275KGE
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP FILM 2.2UF 10% 310VAC RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19974 Pieces
- Dataark:
- 225MKP275KGE.pdf
Introduksjon
BYCHIPS er strømprodusenten for 225MKP275KGE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 225MKP275KGE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 310V |
| Toleranse: | ±10% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.024" L x 0.591" W (26.00mm x 15.00mm) |
| Serie: | MKP |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Driftstemperatur: | -40°C ~ 110°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | 225MKP275KGE |
| Lead Spacing: | 0.886" (22.50mm) |
| Høyde - sittende (maks): | 0.878" (22.30mm) |
| Egenskaper: | X2 Safety Rated |
| Utvidet beskrivelse: | 2.2µF ±10% Film Capacitor 310V Polypropylene (PP), Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 2.2UF 10% 310VAC RADIAL |
| kapasitans: | 2.2µF |
| applikasjoner: | EMI, RFI Suppression |
| Email: | [email protected] |
Beslektede deler til 225MKP275KGE
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
225MKP275KG5 | Illinois Capacitor | CAP FILM 2.2UF 10% 310VAC RADIAL | Forespørsel |
|
225MKP275K | Illinois Capacitor | CAP FILM 2.2UF 10% 310VAC RADIAL | Forespørsel |
|
225MKP275KGG4 | Illinois Capacitor | CAP FILM 2.2UF 10% 310VAC RADIAL | Forespørsel |
|
225MKP275KE | Illinois Capacitor | CAP FILM 2.2UF 10% 310VAC RADIAL | Forespørsel |
|
225MKP275KG | Illinois Capacitor | CAP FILM 2.2UF 10% 310VAC RADIAL | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers