Kjøpe 27E162 med BYCHPS
Kjøp med garanti
27E162
- Delenummer:
- 27E162
- Produsent:
- Beskrivelse:
- SOCKET DP-2P R10 SERIES
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12373 Pieces
- Dataark:
- 27E162.pdf
Introduksjon
BYCHIPS er strømprodusenten for 27E162, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 27E162 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Socket |
|---|---|
| Oppsigelsesstil: | Solder Lug |
| Serie: | R10 |
| Andre navn: | 1-1393143-6 113931436 PB801 |
| Antall posisjoner: | 10 |
| Monteringstype: | Panel Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | 27E162 |
| For bruk med / relaterte produkter: | R10 Series |
| Egenskaper: | Without Grounding |
| Utvidet beskrivelse: | Relay Socket Panel Mount |
| Beskrivelse: | SOCKET DP-2P R10 SERIES |
| Email: | [email protected] |
Beslektede deler til 27E162
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
HP3-SF | Panasonic Electric Works | SOCKET TERM W/CLIP SCREW FOR HP3 | Forespørsel |
 |
SZX-SMF-08N | Honeywell Sensing and Productivity Solutions | SZR SOCKETTRACK MNTING SOCKET | Forespørsel |
 |
27E166 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET CHASSIS MOUNT 4P | Forespørsel |
 |
27E488 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY SOLD TERM K10 SER | Forespørsel |
 |
PY11-0 | Omron Automation and Safety | SOCKET PCB FOR MY3 | Forespørsel |
 |
27E163 | TE Connectivity Potter & Brumfield Relays | SOCKET 4POLE R10 SERIES | Forespørsel |
 |
RSE500414 | Amphenol PCD | SMITHS | Forespørsel |
 |
27E164 | TE Connectivity Potter & Brumfield Relays | SOCKET PHEN 6POLE FOR R10 SER | Forespørsel |
|
27E168 | TE Connectivity Potter & Brumfield Relays | SOCKET NYL 10A FOR KUP93 SER | Forespørsel |
 |
2912345 | Phoenix Contact | 14MM PLC BASIC TERM BLOCK 24V | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog