Kjøpe 27E212 med BYCHPS
Kjøp med garanti
27E212
- Delenummer:
- 27E212
- Beskrivelse:
- SOCKET DP-2P R10 SERIES
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15733 Pieces
- Dataark:
- 27E212.pdf
Introduksjon
BYCHIPS er strømprodusenten for 27E212, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 27E212 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Socket |
|---|---|
| Oppsigelsesstil: | PC Pin |
| Serie: | R10 |
| Andre navn: | 2-1393143-4 2.70E+215 27E212-ND PB805 |
| Antall posisjoner: | 10 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | 27E212 |
| For bruk med / relaterte produkter: | R10 Series |
| Egenskaper: | Without Grounding |
| Utvidet beskrivelse: | Relay Socket Through Hole |
| Beskrivelse: | SOCKET DP-2P R10 SERIES |
| Email: | [email protected] |
Beslektede deler til 27E212
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
RSE116627-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
|
JRS200200 | Amphenol PCD | QUICK MOUNT, 2 POLE | Forespørsel |
|
RSE120153 | Amphenol PCD | LOW PROFILE, 4 POLE/5 AMP, WC | Forespørsel |
 |
8869490000 | Weidmuller | SRC-I 2CO | Forespørsel |
|
RSL116050 | Amphenol PCD | EXTENDED HEIGHT, 4 POLE/10 AMP, | Forespørsel |
 |
27E213 | TE Connectivity Potter & Brumfield Relays | SOCKET 4POLE R10 SERIES | Forespørsel |
 |
P7SA-10P | Omron Automation and Safety | SOCKET RELAY 4POLES G7SA PCB | Forespørsel |
|
RSE116631-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Forespørsel |
 |
DSP2A-PSL2 | Panasonic Electric Works | SOCKET PC MNT FOR DSP2A-L2 RELAY | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers