Kjøpe 28A5776-0A2 med BYCHPS
Kjøp med garanti
28A5776-0A2
- Delenummer:
- 28A5776-0A2
- Beskrivelse:
- FERRITE CORE 210 OHM HINGED
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16510 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28A5776-0A2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28A5776-0A2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 1.150" W x 1.157" H (29.20mm x 29.40mm) |
| Andre navn: | 240-2121 28A57760A2 |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | 28A5776-0A2 |
| Lengde: | 1.654" (42.00mm) |
| Innvendig dimensjon: | 0.764" Dia (19.40mm) |
| Impedans @ Frekvens: | 210 Ohm @ 100MHz |
| Utvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 210 Ohm @ 100MHz ID 0.764" Dia (19.40mm) OD 1.150" W x 1.157" H (29.20mm x 29.40mm) Length 1.654" (42.00mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 210 OHM HINGED |
| Email: | [email protected] |
Beslektede deler til 28A5776-0A2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28B1250-000 | Laird-Signal Integrity Products | FERRITE CORE 186 OHM SOLID | Forespørsel |
 |
LFB220140-000 | Laird-Signal Integrity Products | FERRITE CORE 28 OHM SOLID 14MM | Forespørsel |
 |
FB64-110 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørsel |
 |
28B0375-000 | Laird-Signal Integrity Products | FERRITE CORE 125 OHM SOLID | Forespørsel |
 |
28A2005-0A2 | Laird-Signal Integrity Products | FERRITE CORE 190 OHM HINGED 5MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers