Kjøpe 28B1020-10G med BYCHPS
Kjøp med garanti
28B1020-10G
- Delenummer:
- 28B1020-10G
- Beskrivelse:
- FERRITE CORE SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17370 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28B1020-10G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28B1020-10G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | - |
| Monteringstype: | - |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | 28B1020-10G |
| Lengde: | - |
| Innvendig dimensjon: | - |
| Impedans @ Frekvens: | - |
| Utvidet beskrivelse: | Solid Ferrite Core |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE SOLID |
| Email: | [email protected] |
Beslektede deler til 28B1020-10G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BF2930 | API Delevan Inc. | FERRITE CORE 257 OHM HINGED 13MM | Forespørsel |
 |
ZCAT2017-0930-M | TDK Corporation | FERRITE CORE 50 OHM HINGED 9MM | Forespørsel |
 |
28B1020-100 | Laird-Signal Integrity Products | FERRITE CORE 276 OHM SOLID | Forespørsel |
 |
28B1020-300 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørsel |
 |
KR16FP340812 | Panasonic - DTG | FERRITE CORE 53 OHM SOLID | Forespørsel |
 |
7427216 | Wurth Electronics Inc. | FERRITE CORE 63 OHM SOLID | Forespørsel |
 |
28B1000-000 | Laird-Signal Integrity Products | FERRITE CORE 151 OHM SOLID | Forespørsel |
 |
CF1-36*23*15 | API Delevan Inc. | FERRITE CORE 113 OHM SOLID 23MM | Forespørsel |
 |
BF1835 | API Delevan Inc. | FERRITE CORE 172 OHM HINGED 9MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers