Kjøpe 28R1024-000 med BYCHPS
Kjøp med garanti
28R1024-000
- Delenummer:
- 28R1024-000
- Beskrivelse:
- FERRITE CORE 128 OHM SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12997 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28R1024-000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28R1024-000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Flat |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 1.024" W x 0.236" H (26.00mm x 6.00mm) |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | 28R1024-000 |
| Lengde: | 0.394" (10.00mm) |
| Innvendig dimensjon: | 0.807" W x 0.031" H (20.50mm x 0.80mm) |
| Impedans @ Frekvens: | 128 Ohm @ 100MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 128 Ohm @ 100MHz ID 0.807" W x 0.031" H (20.50mm x 0.80mm) OD 1.024" W x 0.236" H (26.00mm x 6.00mm) Length 0.394" (10.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 128 OHM SOLID |
| Email: | [email protected] |
Beslektede deler til 28R1024-000
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28R1022-000 | Laird-Signal Integrity Products | FERRITE CORE 91 OHM SOLID | Forespørsel |
 |
ESD-FPD-16-1 | KEMET | FERRITE CORE CLIP 25.4MM X 2.6MM | Forespørsel |
 |
74270053 | Wurth Electronics Inc. | FERRITE CORE 258 OHM SOLID 8MM | Forespørsel |
|
28R1025-000 | Laird-Signal Integrity Products | FERRITE CORE 97 OHM SOLID | Forespørsel |
 |
AB4X2X4.5W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 1.5MM | Forespørsel |
 |
KR16TT160918 | Panasonic - DTG | FERRITE CORE 110 OHM SOLID 9MM | Forespørsel |
 |
KR16FP360709 | Panasonic - DTG | FERRITE CORE 48 OHM SOLID | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers