Kjøpe 28R2000-010 med BYCHPS
Kjøp med garanti
28R2000-010
- Delenummer:
- 28R2000-010
- Beskrivelse:
- FERRITE CORE 170 OHM SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12892 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28R2000-010, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28R2000-010 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Flat |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 2.000" W x 0.480" H (50.80mm x 12.20mm) |
| Andre navn: | 240-2338 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | 28R2000-010 |
| Lengde: | 0.598" (15.20mm) |
| Innvendig dimensjon: | 1.600" W x 0.079" H (40.60mm x 2.00mm) |
| Impedans @ Frekvens: | 170 Ohm @ 100MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 170 Ohm @ 100MHz ID 1.600" W x 0.079" H (40.60mm x 2.00mm) OD 2.000" W x 0.480" H (50.80mm x 12.20mm) Length 0.598" (15.20mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 170 OHM SOLID |
| Email: | [email protected] |
Beslektede deler til 28R2000-010
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
7427801 | Wurth Electronics Inc. | FERRITE CORE 79 OHM SOLID | Forespørsel |
 |
742700221 | Wurth Electronics Inc. | FERRITE CORE 45 OHM SOLID 4MM | Forespørsel |
 |
ZCAT4625-3430D-BK | TDK Corporation | FERRITE CORE 35 OHM HINGED | Forespørsel |
 |
28B0686-100 | Laird-Signal Integrity Products | FERRITE CORE 139 OHM SOLID | Forespørsel |
 |
74278041 | Wurth Electronics Inc. | FERRITE CORE 20 OHM SOLID | Forespørsel |
 |
HFB075025-000 | Laird-Signal Integrity Products | FERRITE CORE 157 OHM SOLID | Forespørsel |
 |
28R2000-200 | Laird-Signal Integrity Products | FERRITE CORE 252 OHM SOLID | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog