Kjøpe 305DCN2R7Q med BYCHPS
Kjøp med garanti
305DCN2R7Q
- Delenummer:
- 305DCN2R7Q
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP 3F -10%, +30% 2.7V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12668 Pieces
- Dataark:
- 305DCN2R7Q.pdf
Introduksjon
BYCHIPS er strømprodusenten for 305DCN2R7Q, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 305DCN2R7Q via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | -10%, +30% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | DCN |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -40°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | 305DCN2R7Q |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | 0.138" (3.50mm) |
| Høyde - sittende (maks): | 0.846" (21.50mm) |
| Utvidet beskrivelse: | 3F -10%, +30%(EDLC) Supercapacitor 2.7V Radial, Can 160 mOhm 1000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 160 mOhm |
| Beskrivelse: | CAP 3F -10%, +30% 2.7V T/H |
| kapasitans: | 3F |
| Email: | [email protected] |
Beslektede deler til 305DCN2R7Q
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EDLRF684B5R5C | Cornell Dubilier Electronics (CDE) | CAP 680MF -20% +80% 5.5V T/H | Forespørsel |
 |
CPH3225A | Seiko Instruments | CAP 11MF 3.3V SURFACE MOUNT | Forespørsel |
 |
B49410A2115Q000 | EPCOS (TDK) | CAP 110F -10% +30% 2.5V T/H | Forespørsel |
 |
BMOD0500 P016 B02 | Maxwell Technologies Inc. | CAP 500F 16V CHASSIS MOUNT | Forespørsel |
 |
JUM0H184ACD | Nichicon | CAP 0.18F 20% 5.5V THROUGH HOLE | Forespørsel |
 |
DVN-5R5D104T-R5 | Elna America | CAP 100MF 5.5V SURFACE MOUNT | Forespørsel |
 |
DBJ-5R5D104T | Elna America | CAP 100MF -20% +80% 5.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers