Kjøpe 337AVG025MFBJ med BYCHPS
Kjøp med garanti
337AVG025MFBJ
- Delenummer:
- 337AVG025MFBJ
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP ALUM POLY 330UF 20% 25V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18875 Pieces
- Dataark:
- 337AVG025MFBJ.pdf
Introduksjon
BYCHIPS er strømprodusenten for 337AVG025MFBJ, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 337AVG025MFBJ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 25V |
|---|---|
| Type: | Polymer |
| Toleranse: | ±20% |
| Surface Mount Land Size: | - |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | AVG |
| Ripple Current - Lavfrekvens: | 212.5mA @ 120Hz |
| Ripple Current - High Frequency: | 4.25A @ 100kHz |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | 337AVG025MFBJ |
| Levetid @ Temp.: | 1500 Hrs @ 125°C |
| Lead Spacing: | 0.138" (3.50mm) |
| impedans: | - |
| Høyde - sittende (maks): | 0.532" (13.50mm) |
| Utvidet beskrivelse: | 330µF ±20% 25V Aluminum Polymer Capacitor Radial, Can 602.86 mOhm 1500 Hrs @ 125°C |
| ESR (ekvivalent serieresistens): | 602.86 mOhm |
| Beskrivelse: | CAP ALUM POLY 330UF 20% 25V T/H |
| kapasitans: | 330µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til 337AVG025MFBJ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers