Kjøpe 3630F330MT med BYCHPS
Kjøp med garanti
3630F330MT
- Delenummer:
- 3630F330MT
- Produsent:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- FIXED IND 33UH 2.5A 100 MOHM SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14219 Pieces
- Dataark:
- 1.3630F330MT.pdf2.3630F330MT.pdf
Introduksjon
BYCHIPS er strømprodusenten for 3630F330MT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 3630F330MT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.720" L x 0.551" W (18.30mm x 14.00mm) |
| skjerming: | Shielded |
| Serie: | 3630, Sigma Inductors |
| rangeringer: | - |
| Q @ Freq: | 44 @ 2.52MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 6-1676941-0 6-1676941-0-ND |
| Driftstemperatur: | -25°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 22 Weeks |
| Produsentens varenummer: | 3630F330MT |
| induktans: | 33µH |
| Høyde - sittende (maks): | 0.280" (7.10mm) |
| Frekvens - Test: | 2.5MHz |
| Frekvens - Selvresonans: | 10MHz |
| Utvidet beskrivelse: | 33µH Shielded Wirewound Inductor 2.5A 100 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 33UH 2.5A 100 MOHM SMD |
| DC-motstand (DCR): | 100 mOhm Max |
| Nåværende vurdering: | 2.5A |
| Nåværende - Metning: | 5A |
| Email: | [email protected] |
Beslektede deler til 3630F330MT
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers