Kjøpe 474K500CS6G-FA med BYCHPS
Kjøp med garanti
474K500CS6G-FA
- Delenummer:
- 474K500CS6G-FA
- Produsent:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP NETWORK 0.47UF 500V 8SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19466 Pieces
- Dataark:
- 474K500CS6G-FA.pdf
Introduksjon
BYCHIPS er strømprodusenten for 474K500CS6G-FA, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 474K500CS6G-FA via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 500V |
|---|---|
| Toleranse: | ±10% |
| Temperaturkoeffisient: | - |
| Størrelse / Dimensjon: | 0.701" L x 0.625" W (17.80mm x 15.90mm) |
| Serie: | Capstick® CS |
| rangeringer: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-SMD, Gull Wing |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 474K500CS6G-FA |
| Høyde - sittende (maks): | 0.319" (8.10mm) |
| Utvidet beskrivelse: | 0.47µF ±10% Bussed Capacitor Array 500V 8-SMD, Gull Wing |
| Dielektrisk materiale: | Polymer, Metallized |
| Beskrivelse: | CAP NETWORK 0.47UF 500V 8SMD |
| Kretskort: | Bussed |
| kapasitans: | 0.47µF |
| Email: | [email protected] |
Beslektede deler til 474K500CS6G-FA
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
474K500CS6G | Cornell Dubilier Electronics (CDE) | CAP NETWORK 0.47UF 500V 8SMD | Forespørsel |
|
474K500CS6 | Cornell Dubilier Electronics (CDE) | CAP NETWORK 0.47UF 500V 8DIP | Forespørsel |
 |
W2A25C103MAT2A | AVX Corporation | CAP ARRAY 10000PF 50V X7R 0508 | Forespørsel |
|
474K500CS6-FA | Cornell Dubilier Electronics (CDE) | CAP NETWORK 0.47UF 500V 8DIP | Forespørsel |
 |
CA064C103M5RAC7800 | KEMET | CAP ARRAY 10000PF 50V X7R 0612 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers