Kjøpe 4B06B-540-125/219 med BYCHPS
Kjøp med garanti
4B06B-540-125/219
- Delenummer:
- 4B06B-540-125/219
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- RES NET MULT OHM 13SIP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14432 Pieces
- Dataark:
- 4B06B-540-125/219.pdf
Introduksjon
BYCHIPS er strømprodusenten for 4B06B-540-125/219, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 4B06B-540-125/219 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - klemme: | - |
|---|---|
| Teknologi: | Mixed Technology |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | 13-SIP Module, 6 Leads |
| Antall kretser: | 1 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | 4B06B-540-125/219 |
| Beskrivelse: | RES NET MULT OHM 13SIP |
| applikasjoner: | Telecommunications |
| Email: | [email protected] |
Beslektede deler til 4B06B-540-125/219
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
4B06B-540-095/095 | Bourns Inc. | RES NET MULT OHM 13SIP | Forespørsel |
|
4B06B-540-290/290 | Bourns Inc. | RES NET MULT OHM 13SIP | Forespørsel |
|
4B06B-540-090/260 | Bourns Inc. | RES NET MULT OHM 13SIP | Forespørsel |
 |
P1301CA2RP | Littelfuse Inc. | SIDAC SLIC UNI 120V 50A DO214 | Forespørsel |
 |
SDP1100Q38B | Littelfuse Inc. | SIDAC BI 100V 100A QFN 5X6 8L | Forespørsel |
 |
TL7726CPG4 | Texas Instruments | IC HEX CLAMPING CIRCUITS 8-DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers