Kjøpe 564RR3LBA302EE330K med BYCHPS
Kjøp med garanti
564RR3LBA302EE330K
- Delenummer:
- 564RR3LBA302EE330K
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP CER 33PF 3KV R3L RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17884 Pieces
- Dataark:
- 564RR3LBA302EE330K.pdf
Introduksjon
BYCHIPS er strømprodusenten for 564RR3LBA302EE330K, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 564RR3LBA302EE330K via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 3000V (3kV) |
|---|---|
| Toleranse: | ±10% |
| Tykkelse (Maks): | - |
| Temperaturkoeffisient: | R3L |
| Størrelse / Dimensjon: | - |
| Serie: | Cera-Mite 564R |
| rangeringer: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Disc |
| Driftstemperatur: | -25°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 22 Weeks |
| Produsentens varenummer: | 564RR3LBA302EE330K |
| Lead Style: | Straight |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | Low Dissipation Factor |
| Strykprosent: | - |
| Utvidet beskrivelse: | 33pF ±10% 3000V (3kV) Ceramic Capacitor R3L Radial, Disc |
| Beskrivelse: | CAP CER 33PF 3KV R3L RADIAL |
| kapasitans: | 33pF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til 564RR3LBA302EE330K
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers