Kjøpe 70F226AI-RC med BYCHPS
Kjøp med garanti
70F226AI-RC
- Delenummer:
- 70F226AI-RC
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 2.2UH 1.132A 156 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19919 Pieces
- Dataark:
- 70F226AI-RC.pdf
Introduksjon
BYCHIPS er strømprodusenten for 70F226AI-RC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 70F226AI-RC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±10% |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.160" Dia x 0.250" L (4.06mm x 6.35mm) |
| skjerming: | Unshielded |
| Serie: | 70F |
| rangeringer: | - |
| Q @ Freq: | 43 @ 7.9MHz |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial |
| Andre navn: | 70F226AIRC M8398 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Iron |
| Produsentens varenummer: | 70F226AI-RC |
| induktans: | 2.2µH |
| Høyde - sittende (maks): | - |
| Frekvens - Test: | 7.9MHz |
| Frekvens - Selvresonans: | 87MHz |
| Utvidet beskrivelse: | 2.2µH Unshielded Wirewound Inductor 1.132A 156 mOhm Max Axial |
| Beskrivelse: | FIXED IND 2.2UH 1.132A 156 MOHM |
| DC-motstand (DCR): | 156 mOhm Max |
| Nåværende vurdering: | 1.132A |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til 70F226AI-RC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
70F224AI-RC | Bourns Inc. | FIXED IND 220UH 114MA 11.5 OHM | Forespørsel |
 |
IHSM7832ER820L | Vishay Dale | FIXED IND 82UH 1.9A 184 MOHM SMD | Forespørsel |
 |
70F226AI | Bourns Inc. | FIXED IND 2.2UH 1.132A 156 MOHM | Forespørsel |
 |
VLF504012MT-100M | TDK Corporation | FIXED IND 10UH 1.3A 230 MOHM SMD | Forespørsel |
 |
9230-72-RC | Bourns Inc. | FIXED IND 150UH 85MA 15 OHM TH | Forespørsel |
 |
70F223AI | Bourns Inc. | FIXED IND 2.2MH 57MA 45.6 OHM TH | Forespørsel |
 |
70F224AI | Bourns Inc. | FIXED IND 220UH 114MA 11.5 OHM | Forespørsel |
|
70F227AP | Bourns Inc. | FIXED IND 220NH 2.294A 380 MOHM | Forespørsel |
 |
70F221AF-RC | Bourns Inc. | FIXED IND 220MH 39MA 424 OHM TH | Forespørsel |
 |
70F222AI-RC | Bourns Inc. | FIXED IND 22MH 41MA 144 OHM TH | Forespørsel |
|
70F222AI | Bourns Inc. | FIXED IND 22MH 41MA 144 OHM TH | Forespørsel |
 |
CDRH10D48/ANP-221MC | Sumida America Components Inc. | FIXED IND 220UH 610MA 637 MOHM | Forespørsel |
|
70F227AP-RC | Bourns Inc. | FIXED IND 220NH 2.294A 380 MOHM | Forespørsel |
 |
70F225AI | Bourns Inc. | FIXED IND 22UH 229MA 2.28 OHM TH | Forespørsel |
|
70F225AI-RC | Bourns Inc. | FIXED IND 22UH 229MA 2.28 OHM TH | Forespørsel |
 |
744916151 | Wurth Electronics Inc. | FIXED IND 51NH 360MA 700 MOHM | Forespørsel |
|
70F223AI-RC | Bourns Inc. | FIXED IND 2.2MH 57MA 45.6 OHM TH | Forespørsel |
|
70F221AF | Bourns Inc. | FIXED IND 220MH 39MA 424 OHM TH | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers