Kjøpe 74HC1G66GW,125 med BYCHPS
Kjøp med garanti
74HC1G66GW,125
- Delenummer:
- 74HC1G66GW,125
- Produsent:
- Nexperia
- Beskrivelse:
- IC SWITCH SPST 5TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12486 Pieces
- Dataark:
- 74HC1G66GW,125.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74HC1G66GW,125, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74HC1G66GW,125 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Enkel (V +): | 2 V ~ 10 V |
|---|---|
| Spenning - Forsyning, Dual (V ±): | - |
| Bytt tid (Ton, Toff) (Maks): | 20ns, 20ns |
| Bytt krets: | SPST - NO |
| Leverandør Enhetspakke: | 5-TSSOP |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 5-TSSOP, SC-70-5, SOT-353 |
| Andre navn: | 1727-3263-2 568-2642-2 568-2642-2-ND 74HC1G66GW125 935245770125 |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| On-State Resistance (Max): | 80 Ohm |
| Antall kretser: | 1 |
| Multiplexer / Demultiplekser Circuit: | 1:1 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 74HC1G66GW,125 |
| Utvidet beskrivelse: | 1 Circuit IC Switch 1:1 80 Ohm 5-TSSOP |
| Beskrivelse: | IC SWITCH SPST 5TSSOP |
| Nåværende - Lekkasje (IS (av)) (Maks): | 1µA |
| Crosstalk: | - |
| Charge Injection: | - |
| Kanal-til-kanal-matching (ΔRon): | - |
| Kanalkapasitans (CS (av), CD (av)): | - |
| -3db Båndbredde: | 200MHz |
| Email: | [email protected] |
Beslektede deler til 74HC1G66GW,125
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers