Kjøpe 74LVC1G38GW-Q100H med BYCHPS
Kjøp med garanti
74LVC1G38GW-Q100H
- Delenummer:
- 74LVC1G38GW-Q100H
- Produsent:
- Nexperia
- Beskrivelse:
- IC GATE NAND 1CH 2-INP 5-TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16129 Pieces
- Dataark:
- 74LVC1G38GW-Q100H.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74LVC1G38GW-Q100H, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74LVC1G38GW-Q100H via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.65 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 5-TSSOP |
| Serie: | Automotive, AEC-Q100, 74LVC |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 5-TSSOP, SC-70-5, SOT-353 |
| Andre navn: | 1727-1182-2 568-10362-2 568-10362-2-ND 74LVC1G38GW-Q100,125 74LVC1G38GW-Q100H-ND 935302105125 |
| Driftstemperatur: | -40°C ~ 125°C |
| Antall innganger: | 2 |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Maksimal forplantningsforsinkelse @ V, Max CL: | 3.9ns @ 5V, 50pF |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | 74LVC1G38GW-Q100H |
| Logikk Type: | NAND Gate |
| Logisk nivå - Lav: | 0.7 V ~ 0.8 V |
| Logisk nivå - Høy: | 1.7 V ~ 2 V |
| Egenskaper: | Open Drain |
| Utvidet beskrivelse: | NAND Gate IC 1 Channel Open Drain 5-TSSOP |
| Beskrivelse: | IC GATE NAND 1CH 2-INP 5-TSSOP |
| Nåværende - Quiescent (Maks): | 4µA |
| Nåværende - Utgang Høy, Lav: | -, 32mA |
| Email: | [email protected] |
Beslektede deler til 74LVC1G38GW-Q100H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers