Kjøpe 74SSTUA32866BFG8 med BYCHPS
Kjøp med garanti
74SSTUA32866BFG8
- Delenummer:
- 74SSTUA32866BFG8
- Produsent:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC BUFFER 1.8V CONFIG 96-BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16771 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 74SSTUA32866BFG8, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74SSTUA32866BFG8 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Enhetspakke: | 96-CABGA (13.5x5.5) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 96-LFBGA |
| Andre navn: | IDT74SSTUA32866BFG8 IDT74SSTUA32866BFG8-ND |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall bit: | 25, 14 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | 74SSTUA32866BFG8 |
| Logikk Type: | 1:1, 1:2 Configurable Registered Buffer with Parity |
| Utvidet beskrivelse: | 1:1, 1:2 Configurable Registered Buffer with Parity IC 96-CABGA (13.5x5.5) |
| Beskrivelse: | IC BUFFER 1.8V CONFIG 96-BGA |
| Email: | [email protected] |
Beslektede deler til 74SSTUA32866BFG8
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
74SSTUA32866BFG | IDT, Integrated Device Technology Inc | IC BUFFER 1.8V CONFIG 96-BGA | Forespørsel |
 |
SN74F1016DWG4 | Texas Instruments | IC SCHOTTKY BARRIER DIODE 20SOIC | Forespørsel |
|
74SSTUAE32866ABFG8 | IDT, Integrated Device Technology Inc | IC BUFFER 25BIT CONF REG 96-BGA | Forespørsel |
|
74SSTUAE32866ABFG | IDT, Integrated Device Technology Inc | IC BUFFER 25BIT CONF REG 96-BGA | Forespørsel |
 |
MC10E416FNR2G | ON Semiconductor | IC LINE RCVR QUINT DIFF 28-PLCC | Forespørsel |
 |
MC10EP16DG | ON Semiconductor | IC RCVR/DRVR ECL DIFF 5V 8SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog