Kjøpe 74SSTUB32868AZRHR med BYCHPS
Kjøp med garanti
74SSTUB32868AZRHR
- Delenummer:
- 74SSTUB32868AZRHR
- Produsent:
- Beskrivelse:
- IC REGSTR BUFFER 28-56BIT 176BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15088 Pieces
- Dataark:
- 74SSTUB32868AZRHR.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74SSTUB32868AZRHR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74SSTUB32868AZRHR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Enhetspakke: | 176-NFBGA (6x15) |
| Serie: | 74SSTUB |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | 176-BGA |
| Andre navn: | 296-22020-6 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall bit: | 28 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | 74SSTUB32868AZRHR |
| Logikk Type: | 1:2 Configurable Registered Buffer with Parity |
| Utvidet beskrivelse: | 1:2 Configurable Registered Buffer with Parity IC 176-NFBGA (6x15) |
| Beskrivelse: | IC REGSTR BUFFER 28-56BIT 176BGA |
| Email: | [email protected] |
Beslektede deler til 74SSTUB32868AZRHR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
74SSTUB32868ZRHR | Texas Instruments | IC CONFIG REG BUFF 28BIT 176-BGA | Forespørsel |
|
74SSTUB32865ZJBR | Texas Instruments | IC REGISTERED BUFFER 160-TFBGA | Forespørsel |
|
74SSTUB32865AZJBR | Texas Instruments | IC REGSTR BUFF 28-56BIT 160NFBGA | Forespørsel |
|
74SSTUB32866AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Forespørsel |
|
74SSTUB32864AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers