Kjøpe 74SSTVF16859NLG med BYCHPS
Kjøp med garanti
74SSTVF16859NLG
- Delenummer:
- 74SSTVF16859NLG
- Produsent:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC BUFFER 13-26BIT SSTL 56VFQFPN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15574 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 74SSTVF16859NLG, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74SSTVF16859NLG via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Enhetspakke: | 56-VFQFPN (8x8) |
| Serie: | 74SSTVF |
| emballasje: | Tray |
| Pakke / tilfelle: | 56-VFQFN Exposed Pad |
| Andre navn: | IDT74SSTVF16859NLG IDT74SSTVF16859NLG-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall bit: | 13, 26 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | 74SSTVF16859NLG |
| Logikk Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Utvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 56-VFQFPN (8x8) |
| Beskrivelse: | IC BUFFER 13-26BIT SSTL 56VFQFPN |
| Email: | [email protected] |
Beslektede deler til 74SSTVF16859NLG
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
74SSTVF16859PAG | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Forespørsel |
|
74SSTVF16859NLG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 56VFQFPN | Forespørsel |
|
74SSTVF16859PAG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Forespørsel |
|
74SSTVF16857PAG8 | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Forespørsel |
|
74SSTVF16857PAG | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog