Kjøpe 80HSPS1616CBLGI med BYCHPS
Kjøp med garanti
80HSPS1616CBLGI
- Delenummer:
- 80HSPS1616CBLGI
- Produsent:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC RIO SWITCH GEN2 400FCBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17120 Pieces
- Dataark:
- 80HSPS1616CBLGI.pdf
Introduksjon
BYCHIPS er strømprodusenten for 80HSPS1616CBLGI, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 80HSPS1616CBLGI via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Leverandør Enhetspakke: | 400-FBGA (21x21) |
|---|---|
| Serie: | * |
| emballasje: | Tray |
| Pakke / tilfelle: | 400-BBGA, FCBGA |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 4 (72 Hours) |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | 80HSPS1616CBLGI |
| Utvidet beskrivelse: | IC 400-FBGA (21x21) |
| Beskrivelse: | IC RIO SWITCH GEN2 400FCBGA |
| Email: | [email protected] |
Beslektede deler til 80HSPS1616CBLGI
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
80HSPS1616CHMGI | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
80HSPS1616CHMG | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
80HSPS1616CRM | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
80HSPS1616CBRI | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 FCBGA | Forespørsel |
|
80HSPS1616CRMI | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
80HSPS1616CBR | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 FCBGA | Forespørsel |
|
80HSPS1616CBLG | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers