Kjøpe 8546AG-01LF med BYCHPS
Kjøp med garanti
8546AG-01LF
- Delenummer:
- 8546AG-01LF
- Produsent:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC CLK BUFFER 3:6 266MHZ 24TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18746 Pieces
- Dataark:
- 8546AG-01LF.pdf
Introduksjon
BYCHIPS er strømprodusenten for 8546AG-01LF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 8546AG-01LF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.375 V ~ 3.465 V |
|---|---|
| Type: | Fanout Buffer (Distribution), Multiplexer |
| Leverandør Enhetspakke: | 24-TSSOP |
| Serie: | - |
| Forhold - Input: Output: | 3:6 |
| emballasje: | Tube |
| Pakke / tilfelle: | 24-TSSOP (0.173", 4.40mm Width) |
| Produksjon: | LVDS |
| Andre navn: | 800-2233 ICS8546AG-01LF ICS8546AG-01LF-ND ICS8546AG01LF |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | 8546AG-01LF |
| Input: | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL, Crystal |
| Frekvens - Maks: | 266MHz |
| Utvidet beskrivelse: | Clock Fanout Buffer (Distribution), Multiplexer IC 266MHz 24-TSSOP (0.173", 4.40mm Width) |
| Differensial - Input: Output: | Yes/Yes |
| Beskrivelse: | IC CLK BUFFER 3:6 266MHZ 24TSSOP |
| Email: | [email protected] |
Beslektede deler til 8546AG-01LF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog