Kjøpe 947D311K112BEMSN med BYCHPS
Kjøp med garanti
947D311K112BEMSN
- Delenummer:
- 947D311K112BEMSN
- Produsent:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP FILM 310UF 10% 1.1KVDC SCREW
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14745 Pieces
- Dataark:
- 947D311K112BEMSN.pdf
Introduksjon
BYCHIPS er strømprodusenten for 947D311K112BEMSN, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 947D311K112BEMSN via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 1100V (1.1kV) |
|---|---|
| Spenningsverdier - AC: | 230V |
| Toleranse: | ±10% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 3.543" Dia (90.00mm) |
| Serie: | 947D |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -45°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 19 Weeks |
| Produsentens varenummer: | 947D311K112BEMSN |
| Lead Spacing: | 1.772" (45.00mm) |
| Høyde - sittende (maks): | 3.976" (101.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 310µF ±10% Film Capacitor 230V 1100V (1.1kV) Polypropylene (PP), Metallized Radial, Can |
| ESR (ekvivalent serieresistens): | 1.7 mOhm |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 310UF 10% 1.1KVDC SCREW |
| kapasitans: | 310µF |
| applikasjoner: | DC Link, DC Filtering |
| Email: | [email protected] |
Beslektede deler til 947D311K112BEMSN
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers