Kjøpe 9970620000 med BYCHPS
Kjøp med garanti
9970620000
- Delenummer:
- 9970620000
- Produsent:
- Weidmuller
- Beskrivelse:
- DIN RAIL CQB4 ANGLE COMB 2/IP
- Lead Free Status / RoHS Status:
- Ikke anvendbar / Ikke anvendelig
- Tilgjengelig mengde:
- 19753 Pieces
- Dataark:
- 9970620000.pdf
Introduksjon
BYCHIPS er strømprodusenten for 9970620000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 9970620000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Andre navn: | 997062 CQB4ANGLE |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | 9970620000 |
| For bruk med / relaterte produkter: | - |
| Beskrivelse: | DIN RAIL CQB4 ANGLE COMB 2/IP |
| Tilbehørstype: | - |
| Email: | [email protected] |
Beslektede deler til 9970620000
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
9970600000 | Weidmuller | DIN RAIL CQB2 ANGLE COMB 2/IP | Forespørsel |
|
9970610000 | Weidmuller | DIN RAIL CQB3 ANGLE COMB 2/IP | Forespørsel |
 |
12-P10 | E-T-A | TERM BLOCK 0.250QC 1180 OR 1610 | Forespørsel |
 |
255.0808.0001 | Littelfuse Inc. | INSULATION NUT CF FUSE M8 BOLT | Forespørsel |
 |
BCA603APQ | Eaton | FUSEBLOCK ADDER PLATE BCA SERIES | Forespørsel |
 |
0695900.PX4 | Littelfuse Inc. | SHUNT MCASE 32V 2 | Forespørsel |
|
2A1702-10 | Eaton | LINE SIDE DEAD FRONT ASSEMBLY | Forespørsel |
|
GV2G472A46 | Eaton | COMB BAR 4POS 72MM OPM FUSE HLDR | Forespørsel |
 |
1423696-6 | TE Connectivity Potter & Brumfield Relays | HEX NUT M11-1 | Forespørsel |
 |
2920023 | Phoenix Contact | BASE ELEMENT | Forespørsel |
|
LRU2642R | Littelfuse Inc. | FUSE REDUCER CLASS R 400 TO 200A | Forespørsel |
 |
RBS3827-16B | E-T-A | RESET BUTTON SEAL FOR CIRC BRKR | Forespørsel |
 |
0853.1201 | Schurter Inc. | FUSE CARRIER OGN 5X20MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers