Kjøpe ACCESSORIES-PLASTIC COVER 2.2 med BYCHPS
Kjøp med garanti
ACCESSORIES-PLASTIC COVER 2.2
- Delenummer:
- ACCESSORIES-PLASTIC COVER 2.2
- Produsent:
- Schaffner EMC, Inc.
- Beskrivelse:
- COVER TERM PLAS FN3359 250A
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13865 Pieces
Introduksjon
BYCHIPS er strømprodusenten for ACCESSORIES-PLASTIC COVER 2.2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ACCESSORIES-PLASTIC COVER 2.2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Andre navn: | 1151-051 801918 817-1769 ACCESSORIES-PLASTIC COVER 2.2-ND ACCESSORIES-PLASTICCOVER2.2 ACCESSORIES-PLASTICCOVER2.2-ND ACCESSORIESPLASTICCOVER22 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | ACCESSORIES-PLASTIC COVER 2.2 |
| For bruk med / relaterte produkter: | FN3359 Series |
| Beskrivelse: | COVER TERM PLAS FN3359 250A |
| Tilbehørstype: | Cover |
| Email: | [email protected] |
Beslektede deler til ACCESSORIES-PLASTIC COVER 2.2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 2.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 150/180A | Forespørsel |
 |
ACCESSORIES-PLASTIC COVER 1.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 800/1000A | Forespørsel |
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | Forespørsel |
 |
ACCESSORIES-PLASTIC COVER 2.4 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 600A | Forespørsel |
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | Forespørsel |
 |
ACCESSORIES-PLASTIC COVER 2.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 320/400A | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers