Kjøpe ADC1207S080HW/C1:1 med BYCHPS
Kjøp med garanti
ADC1207S080HW/C1:1
- Delenummer:
- ADC1207S080HW/C1:1
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC ADC 12BIT 80MHZ SGL 48-HTQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16876 Pieces
- Dataark:
- ADC1207S080HW/C1:1.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADC1207S080HW/C1:1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADC1207S080HW/C1:1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning, Digital: | 5V |
|---|---|
| Spenning - Tilførsel, Analog: | 5V |
| Leverandør Enhetspakke: | 48-HTQFP |
| Serie: | - |
| Samplingsfrekvens (per sekund): | 80M |
| Referansetype: | Internal |
| Forhold - S / H: ADC: | 1:1 |
| emballasje: | Tray |
| Pakke / tilfelle: | 48-TQFP Exposed Pad |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall innganger: | 1 |
| Antall bit: | 12 |
| Antall A / D-omformere: | 1 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | ADC1207S080HW/C1:1 |
| Inngangstype: | Differential |
| Egenskaper: | - |
| Utvidet beskrivelse: | 12 Bit Analog to Digital Converter 1 Input 48-HTQFP |
| Beskrivelse: | IC ADC 12BIT 80MHZ SGL 48-HTQFP |
| Datagrensesnitt: | Parallel |
| konfigurasjon: | S/H-ADC |
| Arkitektur: | - |
| Email: | [email protected] |
Beslektede deler til ADC1207S080HW/C1:1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
ADC1210S065HN/C1,5 | NXP USA Inc. | ADC 12BIT SPI 65MSPS 40HVQFN | Forespørsel |
 |
ADC1207S080HW/C1:5 | NXP USA Inc. | IC ADC 12BIT PAR 80MHZ 48-HTQFP | Forespørsel |
|
ADC1207S080HW/C1,1 | NXP USA Inc. | IC ADC 12BIT PAR 80MHZ 48-HTQFP | Forespørsel |
|
ADC1210S080HN/C1:5 | NXP USA Inc. | ADC 12BIT SPI 80MSPS 40HVQFN | Forespørsel |
|
ADC1207S080HW/C1,5 | NXP USA Inc. | IC ADC 12BIT 80MHZ SGL 48-HTQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers