Kjøpe ADG509AKRZ-REEL med BYCHPS
Kjøp med garanti
ADG509AKRZ-REEL
- Delenummer:
- ADG509AKRZ-REEL
- Produsent:
- AD
- Beskrivelse:
- IC MULTIPLEXER DUAL 4X1 16SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18443 Pieces
- Dataark:
- ADG509AKRZ-REEL.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADG509AKRZ-REEL, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADG509AKRZ-REEL via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Enkel (V +): | 10.8 V ~ 16.5 V |
|---|---|
| Spenning - Forsyning, Dual (V ±): | ±10.8 V ~ 16.5 V |
| Bytt tid (Ton, Toff) (Maks): | 300ns, 300ns |
| Bytt krets: | SP4T |
| Leverandør Enhetspakke: | 16-SOIC |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-SOIC (0.154", 3.90mm Width) |
| Andre navn: | ADG509AKRZ-REEL-ND ADG509AKRZ-REELTR |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| On-State Resistance (Max): | 450 Ohm |
| Antall kretser: | 2 |
| Multiplexer / Demultiplekser Circuit: | 4:1 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | ADG509AKRZ-REEL |
| Utvidet beskrivelse: | 2 Circuit IC Switch 4:1 450 Ohm 16-SOIC |
| Beskrivelse: | IC MULTIPLEXER DUAL 4X1 16SOIC |
| Nåværende - Lekkasje (IS (av)) (Maks): | 1nA |
| Crosstalk: | - |
| Charge Injection: | 4pC |
| Kanal-til-kanal-matching (ΔRon): | 22.5 Ohm |
| Kanalkapasitans (CS (av), CD (av)): | 5pF, 11pF |
| -3db Båndbredde: | - |
| Email: | [email protected] |
Beslektede deler til ADG509AKRZ-REEL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers