Kjøpe ADG732BSUZ-REEL med BYCHPS
Kjøp med garanti
ADG732BSUZ-REEL
- Delenummer:
- ADG732BSUZ-REEL
- Produsent:
- AD
- Beskrivelse:
- IC MULTIPLEXER 32X1 48TQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14722 Pieces
- Dataark:
- ADG732BSUZ-REEL.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADG732BSUZ-REEL, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADG732BSUZ-REEL via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Enkel (V +): | 1.8 V ~ 5.5 V |
|---|---|
| Spenning - Forsyning, Dual (V ±): | ±2.5V |
| Bytt tid (Ton, Toff) (Maks): | - |
| Bytt krets: | - |
| Leverandør Enhetspakke: | 48-TQFP (7x7) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 48-TQFP |
| Andre navn: | ADG732BSUZ-REEL-ND ADG732BSUZ-REELTR |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| On-State Resistance (Max): | 5.5 Ohm |
| Antall kretser: | 1 |
| Multiplexer / Demultiplekser Circuit: | 32:1 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | ADG732BSUZ-REEL |
| Utvidet beskrivelse: | 1 Circuit IC Switch 32:1 5.5 Ohm 48-TQFP (7x7) |
| Beskrivelse: | IC MULTIPLEXER 32X1 48TQFP |
| Nåværende - Lekkasje (IS (av)) (Maks): | 250pA |
| Crosstalk: | -72dB @ 1MHz |
| Charge Injection: | 1pC |
| Kanal-til-kanal-matching (ΔRon): | - |
| Kanalkapasitans (CS (av), CD (av)): | 13pF, 275pF |
| -3db Båndbredde: | 18MHz |
| Email: | [email protected] |
Beslektede deler til ADG732BSUZ-REEL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers