Kjøpe ADSP-BF702BCPZ-3 med BYCHPS
Kjøp med garanti
ADSP-BF702BCPZ-3
- Delenummer:
- ADSP-BF702BCPZ-3
- Produsent:
- AD
- Beskrivelse:
- IC DSP LP 256KB L2SR 88LFCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17264 Pieces
- Dataark:
- ADSP-BF702BCPZ-3.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADSP-BF702BCPZ-3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADSP-BF702BCPZ-3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - I / O: | 1.8V, 3.3V |
|---|---|
| Spenning - Core: | 1.10V |
| Type: | Blackfin+ |
| Leverandør Enhetspakke: | 88-LFCSP-VQ (12x12) |
| Serie: | Blackfin® |
| emballasje: | Tray |
| Pakke / tilfelle: | 88-VFQFN Exposed Pad, CSP |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| On-Chip RAM: | 256kB |
| Ikke-flyktig minne: | ROM (512 kB) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 5 Weeks |
| Produsentens varenummer: | ADSP-BF702BCPZ-3 |
| Interface: | CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG |
| Beskrivelse: | IC DSP LP 256KB L2SR 88LFCSP |
| Klokkefrekvens: | 300MHz |
| Email: | [email protected] |
Beslektede deler til ADSP-BF702BCPZ-3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers