Kjøpe AFK226M35C12T-F med BYCHPS
Kjøp med garanti
AFK226M35C12T-F
- Delenummer:
- AFK226M35C12T-F
- Produsent:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP ALUM 22UF 20% 35V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18699 Pieces
- Dataark:
- AFK226M35C12T-F.pdf
Introduksjon
BYCHIPS er strømprodusenten for AFK226M35C12T-F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AFK226M35C12T-F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 35V |
|---|---|
| Toleranse: | ±20% |
| Surface Mount Land Size: | 0.209" L x 0.256" W (5.30mm x 6.50mm) |
| Størrelse / Dimensjon: | 0.197" Dia (5.00mm) |
| Serie: | AFK |
| Ripple Current: | 120mA @ 120Hz |
| polarisering: | Polar |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | Radial, Can - SMD |
| Andre navn: | 338-2163-6 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 23 Weeks |
| Produsentens varenummer: | AFK226M35C12T-F |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedans: | 700 mOhm |
| Høyde - sittende (maks): | 0.240" (6.10mm) |
| Utvidet beskrivelse: | 22µF 35V Aluminum Capacitors Radial, Can - SMD 700 mOhm 2000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | 700 mOhm |
| Beskrivelse: | CAP ALUM 22UF 20% 35V SMD |
| kapasitans: | 22µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til AFK226M35C12T-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers