Kjøpe AFS1842.5S4 med BYCHPS
Kjøp med garanti
AFS1842.5S4
- Delenummer:
- AFS1842.5S4
- Produsent:
- Abracon Corporation
- Beskrivelse:
- FILTER SAW 1842.500MHZ SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16926 Pieces
- Dataark:
- AFS1842.5S4.pdf
Introduksjon
BYCHIPS er strømprodusenten for AFS1842.5S4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AFS1842.5S4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Størrelse / Dimensjon: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
|---|---|
| Serie: | - |
| rangeringer: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 6-SMD, No Lead |
| Andre navn: | 300-9240-2 300-9240-2-ND 535-9240-2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | AFS1842.5S4 |
| Innsettingstap: | 3dB |
| Høyde (maks): | 0.059" (1.50mm) |
| Frekvens - Senter: | 1.843GHz |
| Beskrivelse: | FILTER SAW 1842.500MHZ SMD |
| båndbredde: | 75MHz |
| applikasjoner: | Cell Phone |
| Email: | [email protected] |
Beslektede deler til AFS1842.5S4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B39401B3823Z810V3 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW | Forespørsel |
|
B39901B3835U410W9 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW | Forespørsel |
 |
B39421B5048Z810 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 420.0MHZ SMD | Forespørsel |
 |
B39162B3529U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | FILTER SAW 1601.50MHZ SMD | Forespørsel |
 |
ECS-DSF400.0A-51-TR | ECS Inc. | SAW FILTER 400.0MHZ | Forespørsel |
 |
RF1404C | Murata Electronics North America | FILTER SAW RF 433.92MHZ SM5050-8 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers