Kjøpe AISM-1812-5R6K-T med BYCHPS
Kjøp med garanti
AISM-1812-5R6K-T
- Delenummer:
- AISM-1812-5R6K-T
- Produsent:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 5.6UH 300MA 1.1 OHM
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 12517 Pieces
Introduksjon
BYCHIPS er strømprodusenten for AISM-1812-5R6K-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AISM-1812-5R6K-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±10% |
| Leverandør Enhetspakke: | 1812 |
| Størrelse / Dimensjon: | 0.177" L x 0.126" W (4.50mm x 3.20mm) |
| skjerming: | Unshielded |
| Serie: | AISM-1812 |
| rangeringer: | - |
| Q @ Freq: | 50 @ 7.96MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 1812 (4532 Metric) |
| Andre navn: | AISM-1812-5R6K-TTR AISM18125R6KT |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | AISM-1812-5R6K-T |
| induktans: | 5.6µH |
| Høyde - sittende (maks): | 0.110" (2.80mm) |
| Frekvens - Test: | 7.96MHz |
| Frekvens - Selvresonans: | 33MHz |
| Utvidet beskrivelse: | 5.6µH Unshielded Wirewound Inductor 300mA 1.1 Ohm Max 1812 (4532 Metric) |
| Beskrivelse: | FIXED IND 5.6UH 300MA 1.1 OHM |
| DC-motstand (DCR): | 1.1 Ohm Max |
| Nåværende vurdering: | 300mA |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til AISM-1812-5R6K-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers