Kjøpe ALS70U912NW450 med BYCHPS
Kjøp med garanti
ALS70U912NW450
- Delenummer:
- ALS70U912NW450
- Produsent:
- KEMET
- Beskrivelse:
- ALU SCREW TERMINAL 9100UF 450V
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19536 Pieces
- Dataark:
- ALS70U912NW450.pdf
Introduksjon
BYCHIPS er strømprodusenten for ALS70U912NW450, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ALS70U912NW450 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | ALS70U912NW450 |
| Utvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | ALU SCREW TERMINAL 9100UF 450V |
| Email: | [email protected] |
Beslektede deler til ALS70U912NW450
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
ALS70H203KF100 | KEMET | ALU SCREW TERMINAL 20000UF 100V | Forespørsel |
|
ALS70U914NS025 | KEMET | ALU SCREW TERMINAL 910000UF 25V | Forespørsel |
|
ALS70U912NS500 | KEMET | ALU SCREW TERMINAL 9100UF 500V | Forespørsel |
|
ALS70A333KE063 | KEMET | CAP ALUM 33000UF 20% 63V SCREW | Forespørsel |
|
ALS70A272QC500 | KEMET | ALU SCREW TERMINAL 2700UF 500V | Forespørsel |
|
ALS70C684NW025 | KEMET | ALU SCREW TERMINAL 680000UF 25V | Forespørsel |
|
ALS70U363NT200 | KEMET | ALU SCREW TERMINAL 36000UF 200V | Forespørsel |
|
ALS70U822NF350 | KEMET | ALU SCREW TERMINAL 8200UF 350V | Forespørsel |
|
ALS70U914NT025 | KEMET | ALU SCREW TERMINAL 910000UF 25V | Forespørsel |
|
ALS70P274NT063 | KEMET | ALU SCREW TERMINAL 270000UF 63V | Forespørsel |
|
ALS70G104NT100 | KEMET | ALU SCREW TERMINAL 100000UF 100V | Forespørsel |
|
ALS70U912NP400 | KEMET | ALU SCREW TERMINAL 9100UF 400V | Forespørsel |
|
ALS70H562LM350 | KEMET | ALU SCREW TERMINAL 5600UF 350V | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers