Kjøpe AP6C64AA med BYCHPS
Kjøp med garanti
AP6C64AA
- Delenummer:
- AP6C64AA
- Beskrivelse:
- BREAKER PANEL (4)20X25A 48V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 18640 Pieces
- Dataark:
- AP6C64AA.pdf
Introduksjon
BYCHIPS er strømprodusenten for AP6C64AA, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AP6C64AA via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | - |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | AP6C64AA |
| For bruk med / relaterte produkter: | - |
| Beskrivelse: | BREAKER PANEL (4)20X25A 48V |
| Tilbehørstype: | - |
| Email: | [email protected] |
Beslektede deler til AP6C64AA
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
AP6C69AA | Artesyn Embedded Technologies | CIRCUIT BREAKER | Forespørsel |
 |
1443996-4 | TE Connectivity AMP Connectors | COVER, 60 POS, W/O FUSE HLDR/NO | Forespørsel |
|
AP6C60PC | Artesyn Embedded Technologies | BREAKER PANEL E/W 5X25A | Forespørsel |
|
AP6C60CA | Artesyn Embedded Technologies | BREAKER PANEL CHASSIS/ALARM | Forespørsel |
 |
2A1667-18 | Eaton | ASSEMBLY WITH LOUVERS 50IN FLUSH | Forespørsel |
|
AP6C69CA | Artesyn Embedded Technologies | CIRCUIT BREAKER | Forespørsel |
|
AP6C69DA | Artesyn Embedded Technologies | CIRCUIT BREAKER | Forespørsel |
|
GRS63/A | Eaton | FUSE ADAPTER | Forespørsel |
|
AP6C69BA | Artesyn Embedded Technologies | CIRCUIT BREAKER | Forespørsel |
 |
DM360 | Schurter Inc. | CBE ADAPTER FOR TA45 | Forespørsel |
|
AP6C67PA | Artesyn Embedded Technologies | CIRCUIT BREAKER | Forespørsel |
|
2A1938-11 | Eaton | MAIN SWITCH SUB ASSY 400A | Forespørsel |
 |
Y30019201 | E-T-A | HEX NUT 3/8X27UNS FOR ETA | Forespørsel |
|
AP6C66PC | Artesyn Embedded Technologies | MODULE ALARM SPARE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers