Kjøpe APTGL180A120T3AG med BYCHPS
Kjøp med garanti
APTGL180A120T3AG
- Delenummer:
- APTGL180A120T3AG
- Produsent:
- Microsemi
- Beskrivelse:
- IGBT ARRAY 1200V 230A 940W SP3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17480 Pieces
- Dataark:
- APTGL180A120T3AG.pdf
Introduksjon
BYCHIPS er strømprodusenten for APTGL180A120T3AG, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for APTGL180A120T3AG via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.2V @ 15V, 150A |
| Leverandør Enhetspakke: | SP3 |
| Serie: | - |
| Strøm - Maks: | 940W |
| Pakke / tilfelle: | SP3 |
| Andre navn: | APTGL180A120T3AGMP APTGL180A120T3AGMP-ND |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| NTC-termistor: | Yes |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 22 Weeks |
| Produsentens varenummer: | APTGL180A120T3AG |
| Input Kapasitans (Cies) @ Vce: | 9.3nF @ 25V |
| Input: | Standard |
| IGBT Type: | Trench Field Stop |
| Utvidet beskrivelse: | IGBT Module Trench Field Stop Half Bridge 1200V 230A 940W Chassis Mount SP3 |
| Beskrivelse: | IGBT ARRAY 1200V 230A 940W SP3 |
| Gjeldende - Samler Cutoff (Maks): | 300µA |
| Nåværende - Samler (Ic) (Maks): | 230A |
| konfigurasjon: | Half Bridge |
| Email: | [email protected] |
Beslektede deler til APTGL180A120T3AG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog