Kjøpe AS3543-ECTP med BYCHPS
Kjøp med garanti
AS3543-ECTP
- Delenummer:
- AS3543-ECTP
- Produsent:
- ams
- Beskrivelse:
- IC CODEC AUDIO FRONT END 68CTBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13451 Pieces
- Dataark:
- AS3543-ECTP.pdf
Introduksjon
BYCHIPS er strømprodusenten for AS3543-ECTP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AS3543-ECTP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.7 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 68-CTBGA (6x6) |
| spesifikasjoner: | - |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 68-TFBGA |
| Driftstemperatur: | -20°C ~ 85°C (TA) |
| Antall kanaler: | 6 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | AS3543-ECTP |
| Interface: | Serial |
| Funksjon: | Audio Signal Processor |
| Utvidet beskrivelse: | Audio Audio Signal Processor 6 Channel 68-CTBGA (6x6) |
| Beskrivelse: | IC CODEC AUDIO FRONT END 68CTBGA |
| applikasjoner: | Digital Audio Interfacing |
| Email: | [email protected] |
Beslektede deler til AS3543-ECTP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
ZL38062LDF1 | Microsemi Corporation | IC AUDIO PROC SEC CAM 56WLCSP | Forespørsel |
 |
TDA7718BTR | STMicroelectronics | IC CAR RADIO PROC 3BAND 28TSSOP | Forespørsel |
 |
MFA100FHI33/01E | NXP USA Inc. | IC AUDIO DEVICE 32HVQFN | Forespørsel |
 |
MAX4399CTK+D | Maxim Integrated | IC SW A/V SCART CON 68-TQFN | Forespørsel |
 |
AS3543 | ams | IC CODEC AUDIO FRONT CTBGA68 (6X | Forespørsel |
 |
AS3542-EMFP | ams | IC CODEC AUDIO FRONT END 56MLF2 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers