Kjøpe ASPI-0315FSSA-2R2M-T3 med BYCHPS
Kjøp med garanti
ASPI-0315FSSA-2R2M-T3
- Delenummer:
- ASPI-0315FSSA-2R2M-T3
- Produsent:
- Abracon Corporation
- Beskrivelse:
- FIXED IND 2.2UH 1.28A 60 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13088 Pieces
- Dataark:
- ASPI-0315FSSA-2R2M-T3.pdf
Introduksjon
BYCHIPS er strømprodusenten for ASPI-0315FSSA-2R2M-T3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ASPI-0315FSSA-2R2M-T3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| skjerming: | Shielded |
| Serie: | ASPI-0315FSSA |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 535-10737-2 ASPI-0315FSSA-2R2M-T4 |
| Driftstemperatur: | -30°C ~ 100°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens varenummer: | ASPI-0315FSSA-2R2M-T3 |
| induktans: | 2.2µH |
| Høyde - sittende (maks): | 0.059" (1.50mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 2.2µH Shielded Wirewound Inductor 1.28A 60 mOhm Nonstandard |
| Beskrivelse: | FIXED IND 2.2UH 1.28A 60 MOHM |
| DC-motstand (DCR): | 60 mOhm |
| Nåværende vurdering: | 1.28A |
| Nåværende - Metning: | 1.6A |
| Email: | [email protected] |
Beslektede deler til ASPI-0315FSSA-2R2M-T3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers