Kjøpe AT83C23OK203-ALRUM med BYCHPS
Kjøp med garanti
AT83C23OK203-ALRUM
- Delenummer:
- AT83C23OK203-ALRUM
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC OMNIKEY PCLINK 3-5.5V 32VQFP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14825 Pieces
- Dataark:
- AT83C23OK203-ALRUM.pdf
Introduksjon
BYCHIPS er strømprodusenten for AT83C23OK203-ALRUM, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AT83C23OK203-ALRUM via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 32-VQFP (7x7) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 32-LQFP |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | AT83C23OK203-ALRUM |
| Interface: | USB |
| Utvidet beskrivelse: | Interface 32-VQFP (7x7) |
| Beskrivelse: | IC OMNIKEY PCLINK 3-5.5V 32VQFP |
| applikasjoner: | - |
| Email: | [email protected] |
Beslektede deler til AT83C23OK203-ALRUM
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
AT83C22OK104-RDTUM | Microchip Technology | IC 8051 MCU W/SMART CARD 64VQFP | Forespørsel |
 |
AT83C23OK101-RATIM | Microchip Technology | IC 8051 MCU W/SMART CARD 32VQFP | Forespørsel |
|
AT83C23OK203-RARUM | Microchip Technology | IC OMNIKEY PCLINK 3-5.5V 32VQFP | Forespørsel |
|
AT83C23OK203-ALTUM | Microchip Technology | IC OMNIKEY PCLINK 3-5.5V 32VQFP | Forespørsel |
 |
AT83C23OK203-RATUM | Microchip Technology | IC 8051 MCU W/SMART CARD 32VQFP | Forespørsel |
|
AT83C23OK203-Z1TUM | Microchip Technology | IC OMNIKEY PCLINK 3-5.5V 32QFN | Forespørsel |
|
AT83C24B-SSUM | Microchip Technology | IC SMART CARD READER W/PM SO-28 | Forespørsel |
|
AT83C24B-Z1RUL | Microchip Technology | IC SMART CARD READER W/PM 28-QFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers