Kjøpe B25834U7684K11 med BYCHPS
Kjøp med garanti
B25834U7684K11
- Delenummer:
- B25834U7684K11
- Produsent:
- EPCOS
- Beskrivelse:
- CAP FILM 0.68UF 20% 1KVAC SCREW
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15934 Pieces
- Dataark:
- B25834U7684K11.pdf
Introduksjon
BYCHIPS er strømprodusenten for B25834U7684K11, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B25834U7684K11 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 1000V (1kV) |
| Toleranse: | ±20% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | - |
| Serie: | B25834 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | B25834U7684K 11 B25834U7684K011 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B25834U7684K11 |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Utvidet beskrivelse: | 0.68µF ±20% Film Capacitor 1000V (1kV) Polypropylene (PP), Metallized Radial, Can |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 0.68UF 20% 1KVAC SCREW |
| kapasitans: | 0.68µF |
| applikasjoner: | Commutating; Damping |
| Email: | [email protected] |
Beslektede deler til B25834U7684K11
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B25834F6474M1 | EPCOS (TDK) | CAP FILM 0.47UF 20% 900VAC SCREW | Forespørsel |
|
B25834F4225K1 | EPCOS (TDK) | CAP FILM 2.2UF 10% 600VAC SCREW | Forespørsel |
|
B25834U7305K11 | EPCOS (TDK) | CAP FILM 3UF 10% 1KVAC SCREW | Forespørsel |
|
B25834U7605K11 | EPCOS (TDK) | CAP FILM 6UF 10% 1KVAC SCREW | Forespørsel |
|
B25834F6335J1 | EPCOS (TDK) | CAP FILM 3.3UF 10% 900VAC SCREW | Forespørsel |
|
B25834C6476K4 | EPCOS (TDK) | CAP FILM 47UF 10% 900VAC SCREW | Forespørsel |
|
B25834C5476K4 | EPCOS (TDK) | CAP FILM 47UF 10% 750VAC SCREW | Forespørsel |
|
B25834D2475K4 | EPCOS (TDK) | CAP FILM 4.7UF 10% 2.1KVAC SCREW | Forespørsel |
|
B25834B6106K4 | EPCOS (TDK) | CAP FILM 10UF 10% 900VAC SCREW | Forespørsel |
|
B25834D2156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 2.1KVAC SCREW | Forespørsel |
|
B25834U7474K11 | EPCOS (TDK) | CAP FILM 0.47UF 20% 1KVAC SCREW | Forespørsel |
|
B25834D7336K4 | EPCOS (TDK) | CAP FILM 33UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25834D1226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 1.7KVAC SCREW | Forespørsel |
|
B25834U7505K11 | EPCOS (TDK) | CAP FILM 5UF 10% 1KVAC SCREW | Forespørsel |
|
B25834U7705K11 | EPCOS (TDK) | CAP FILM 7UF 10% 1KVAC SCREW | Forespørsel |
|
B25834L5685K9 | EPCOS (TDK) | CAP FILM 6.8UF 10% 750VAC SCREW | Forespørsel |
|
B25834D4107K4 | EPCOS (TDK) | CAP FILM 100UF 10% 600VAC SCREW | Forespørsel |
|
B25834U7405K11 | EPCOS (TDK) | CAP FILM 4UF 10% 1KVAC SCREW | Forespørsel |
|
B25834L3336K9 | EPCOS (TDK) | CAP FILM 33UF 10% 500VAC SCREW | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers