Kjøpe B25838K4225K1 med BYCHPS
Kjøp med garanti
B25838K4225K1
- Delenummer:
- B25838K4225K1
- Produsent:
- EPCOS
- Beskrivelse:
- CAP FILM 2.2UF 600VAC QC TERM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17899 Pieces
- Dataark:
- B25838K4225K1.pdf
Introduksjon
BYCHIPS er strømprodusenten for B25838K4225K1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B25838K4225K1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 600V |
| Toleranse: | ±10% |
| Avslutning: | Quick Connect Tab - 0.248" (6.30mm) |
| Størrelse / Dimensjon: | 1.575" Dia (40.00mm) |
| Serie: | B25838 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | B25838K4225K 1 B25838K4225K001 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B25838K4225K1 |
| Lead Spacing: | 1.378" (35.00mm) |
| Høyde - sittende (maks): | 2.244" (57.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 2.2µF ±10% Film Capacitor 600V Radial, Can |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | - |
| Beskrivelse: | CAP FILM 2.2UF 600VAC QC TERM |
| kapasitans: | 2.2µF |
| applikasjoner: | Damping |
| Email: | [email protected] |
Beslektede deler til B25838K4225K1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B25838T225K4 | EPCOS (TDK) | CAP FILM 2.2UF 1.4KVAC QC TERM | Forespørsel |
|
B25838K6105K1 | EPCOS (TDK) | CAP FILM 1UF 10% 900VAC QC TERM | Forespørsel |
|
B25838K6225K1 | EPCOS (TDK) | CAP FILM 2.2UF 900VAC QC TERM | Forespørsel |
|
B25838L8186K4 | EPCOS (TDK) | CAP FILM 18UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25838L8156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25838L4106K4 | EPCOS (TDK) | CAP FILM 10UF 10% 600VAC SCREW | Forespørsel |
|
B25838L8475K4 | EPCOS (TDK) | CAP FILM 4.7UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25838L6226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 900VAC SCREW | Forespørsel |
|
B25838K4475K9 | EPCOS (TDK) | CAP FILM 4.7UF 600VAC QC TERM | Forespørsel |
|
B25838L4156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 600VAC SCREW | Forespørsel |
|
B25838L4226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 600VAC SCREW | Forespørsel |
|
B25838L6156K4 | EPCOS (TDK) | CAP FILM 15UF 10% 900VAC SCREW | Forespørsel |
|
B25838A8474M | EPCOS (TDK) | CAP FILM 0.47UF 1.1KVAC QC TERM | Forespørsel |
|
B25838T156J4 | EPCOS (TDK) | CAP FILM 15UF 5% 1.4KVAC QC TERM | Forespørsel |
|
B25838L6126K4 | EPCOS (TDK) | CAP FILM 12UF 10% 900VAC SCREW | Forespørsel |
|
B25838L8226K4 | EPCOS (TDK) | CAP FILM 22UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25838T6685K4 | EPCOS (TDK) | CAP FILM 6.8UF 900VAC QC TERM | Forespørsel |
|
B25838L8126K4 | EPCOS (TDK) | CAP FILM 12UF 10% 1.1KVAC SCREW | Forespørsel |
|
B25838T8225J4 | EPCOS (TDK) | CAP FILM 2.2UF 1.1KVAC QC TERM | Forespørsel |
|
B25838T5605K14 | EPCOS (TDK) | CAP FILM 6UF 10% 750VAC QC TERM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers