Kjøpe B32361B3107J030 med BYCHPS
Kjøp med garanti
B32361B3107J030
- Delenummer:
- B32361B3107J030
- Produsent:
- EPCOS
- Beskrivelse:
- CAP FILM 100UF 5% 330VAC RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17428 Pieces
- Dataark:
- B32361B3107J030.pdf
Introduksjon
BYCHIPS er strømprodusenten for B32361B3107J030, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B32361B3107J030 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 330V |
| Toleranse: | ±5% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 2.500" Dia (63.50mm) |
| Serie: | B32361 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 495-75674 B32361B3107J 30 B32361B3107J030-ND B32361B3107J30 |
| Driftstemperatur: | -40°C ~ 70°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B32361B3107J030 |
| Lead Spacing: | 1.378" (35.00mm) |
| Høyde - sittende (maks): | 5.276" (134.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 100µF ±5% Film Capacitor 330V Polypropylene (PP), Metallized Radial, Can |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 100UF 5% 330VAC RADIAL |
| kapasitans: | 100µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til B32361B3107J030
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog