Kjøpe B32522Q1105K med BYCHPS
Kjøp med garanti
B32522Q1105K
- Delenummer:
- B32522Q1105K
- Produsent:
- EPCOS
- Beskrivelse:
- CAP FILM 1UF 10% 100VDC RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16836 Pieces
- Dataark:
- B32522Q1105K.pdf
Introduksjon
BYCHIPS er strømprodusenten for B32522Q1105K, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B32522Q1105K via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 100V |
|---|---|
| Spenningsverdier - AC: | 63V |
| Toleranse: | ±10% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 0.709" L x 0.236" W (18.00mm x 6.00mm) |
| Serie: | B32522 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | B32522Q1105K000 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B32522Q1105K |
| Lead Spacing: | 0.591" (15.00mm) |
| Høyde - sittende (maks): | 0.433" (11.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 1µF ±10% Film Capacitor 63V 100V Polyester, Polyethylene Terephthalate (PET), Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Terephthalate (PET), Metallized |
| Beskrivelse: | CAP FILM 1UF 10% 100VDC RADIAL |
| kapasitans: | 1µF |
| applikasjoner: | Automotive; EMI, RFI Suppression |
| Email: | [email protected] |
Beslektede deler til B32522Q1105K
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B32522Q1225K189 | EPCOS (TDK) | CAP FILM 2.2UF 10% 100VDC RADIAL | Forespørsel |
 |
B32522Q1155K289 | EPCOS (TDK) | CAP FILM 1.5UF 10% 100VDC RADIAL | Forespørsel |
 |
B32522C1155K | EPCOS (TDK) | CAP FILM 1.5UF 10% 100VDC RADIAL | Forespørsel |
 |
B32522E6474K000 | EPCOS (TDK) | CAP FILM 0.47UF 10% 400VDC RAD | Forespørsel |
 |
B32522C6104K189 | EPCOS (TDK) | CAP FILM 0.1UF 10% 400VDC RADIAL | Forespørsel |
|
B32522C1225K | EPCOS (TDK) | CAP FILM 2.2UF 10% 100VDC RADIAL | Forespørsel |
|
B32522C3224J | EPCOS (TDK) | CAP FILM 0.22UF 5% 250VDC RADIAL | Forespørsel |
|
B32522Q1335K189 | EPCOS (TDK) | CAP FILM 3.3UF 10% 100VDC RADIAL | Forespørsel |
 |
B32522Q1335K | EPCOS (TDK) | CAP FILM 3.3UF 10% 100VDC RADIAL | Forespørsel |
|
B32522Q1335K289 | EPCOS (TDK) | CAP FILM 3.3UF 10% 100VDC RADIAL | Forespørsel |
|
B32522C0475M189 | EPCOS (TDK) | CAP FILM 4.7UF 20% 63VDC RADIAL | Forespørsel |
|
B32522N6224J189 | EPCOS (TDK) | CAP FILM 0.22UF 5% 450VDC RADIAL | Forespørsel |
|
B32522C3224M289 | EPCOS (TDK) | CAP FILM 0.22UF 20% 250VDC RAD | Forespørsel |
|
B32522Q1225K | EPCOS (TDK) | CAP FILM 2.2UF 10% 100VDC RADIAL | Forespørsel |
|
B32522C6274K | EPCOS (TDK) | CAP FILM 0.27UF 10% 400VDC RAD | Forespørsel |
|
B32522Q8104M | EPCOS (TDK) | CAP FILM 0.1UF 20% 630VDC RADIAL | Forespørsel |
|
B32522C1105K189 | EPCOS (TDK) | CAP FILM 1UF 10% 100VDC RADIAL | Forespørsel |
|
B32522Q8224K189 | EPCOS (TDK) | CAP FILM 0.22UF 10% 630VDC RAD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers